• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Patent holdings for IPC class H01L 25/07

Total number of patents in this class: 5237

10-year publication summary

302
414
406
538
508
469
443
492
469
194
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Mitsubishi Electric Corporation
43934
597
Fuji Electric Co., Ltd.
4750
396
Rohm Co., Ltd.
5843
347
Denso Corporation
23338
200
Intel Corporation
45621
131
Murata Manufacturing Co., Ltd.
22355
120
Infineon Technologies AG
8189
111
Shindengen Electric Manufacturing Co., Ltd.
774
98
Sumitomo Electric Industries, Ltd.
14131
94
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
93
Hitachi Automotive Systems, Ltd.
3970
83
Sony Semiconductor Solutions Corporation
8770
83
Hitachi, Ltd.
16452
76
Siemens AG
24990
69
Hitachi Astemo, Ltd.
5618
69
Panasonic Corporation
20786
63
Semiconductor Components Industries, L.L.C.
5345
61
TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION)
13301
45
Infineon Technologies Americas Corp.
768
44
Hitachi Power Semiconductor Device, Ltd.
195
42
Other owners 2415